The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Jul. 19, 2018
Applicant:

Asm Ip Holding B.v., Almere, NL;

Inventors:

Young Hoon Kim, Chungcheongnam-do, KR;

Jong Wan Choi, Gyeonggi-do, KR;

Jeong Jun Woo, Chungcheongnam-do, KR;

Tae Hee Yoo, Chungcheongnam-do, KR;

Assignee:

ASM IP Holding B.V., Almere, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 27/11582 (2017.01); H01L 21/822 (2006.01); H01L 27/11556 (2017.01); H01L 27/11548 (2017.01); H01L 27/11575 (2017.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/0234 (2013.01); H01L 21/02219 (2013.01); H01L 21/02274 (2013.01); H01L 21/311 (2013.01); H01L 21/3105 (2013.01); H01L 21/31105 (2013.01); H01L 21/31111 (2013.01); H01L 21/31127 (2013.01); H01L 21/8221 (2013.01); H01L 27/11548 (2013.01); H01L 27/11556 (2013.01); H01L 27/11575 (2013.01); H01L 27/11582 (2013.01);
Abstract

Provided is a substrate processing method capable of preventing over-etching of a part of a stair-case structure due to an etching solution, when a barrier layer is selectively formed on a VNAND device having the stair-case structure. The substrate processing method includes: alternately stacking a first insulating layer and a second insulating layer; forming a stepped structure having an upper surface, a lower surface, and a side surface connecting the upper surface to the lower surface by etching the first insulating layer and the second insulating layer that are stacked; densifying the stepped structure; forming a barrier layer on the densified second insulating layer; and performing isotropic etching on at least a part of a sacrificial word line structure including the second insulating layer and the barrier layer. During etching the barrier layer at the isotropic etching step, the second insulating layer is not etched or etched a little to an ignorable degree.


Find Patent Forward Citations

Loading…