The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Apr. 11, 2018
Applicant:
Entegris, Inc., Billerica, MA (US);
Inventors:
Donald Frye, Sherman, CT (US);
Jun Liu, Brookfield, CT (US);
Daniela White, Ridgefield, CT (US);
Michael White, Ridgefield, CT (US);
Assignee:
ENTEGRIS, INC., Billerica, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 3/30 (2006.01); C11D 3/00 (2006.01); C11D 11/00 (2006.01); C11D 3/33 (2006.01); C11D 3/20 (2006.01); C11D 3/36 (2006.01); H01L 21/02 (2006.01); C11D 3/04 (2006.01); C11D 3/28 (2006.01);
U.S. Cl.
CPC ...
C11D 3/0073 (2013.01); C11D 3/0047 (2013.01); C11D 3/044 (2013.01); C11D 3/2068 (2013.01); C11D 3/2082 (2013.01); C11D 3/28 (2013.01); C11D 3/30 (2013.01); C11D 3/33 (2013.01); C11D 3/361 (2013.01); C11D 11/0047 (2013.01); H01L 21/02074 (2013.01);
Abstract
A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material. In addition, the cleaning compositions are compatible with ruthenium-containing materials.