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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10727127 B1

PDFFull Text
Date of Patent:
Jul. 28, 2020

Filed:

Jan. 16, 2018

Method of processing a substrate

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Hiroshi Morikazu, Tokyo, JP;

Karl Heinz Priewasser, Munich, DE;

Nao Hattori, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain Ltd.

Primary Examiner:

Angel Roman

Int. Cl.
CPC ...
H01L 21/78 (2006.01); B23K 26/0622 (2014.01); B23K 26/38 (2014.01); B28D 5/02 (2006.01); B23K 26/00 (2014.01); B23K 26/08 (2014.01); B23K 26/53 (2014.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01); H01L 21/304 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/0006 (2013.01); B23K 26/0622 (2015.10); B23K 26/0876 (2013.01); B23K 26/38 (2013.01); B23K 26/53 (2015.10); B28D 5/022 (2013.01); B23K 2101/40 (2018.08); B23K 2103/52 (2018.08); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08); H01L 21/304 (2013.01); H01L 33/0095 (2013.01);
Abstract

A method of processing a substrate, having a first surface with at least one division line formed thereon and a second surface opposite the first surface, includes applying a pulsed laser beam to the substrate from the side of the first surface, at least in a plurality of positions along the at least one division line, so as to form a plurality of modified regions in the substrate, each modified region extending at least from the first surface towards the second surface. Each modified region is formed by melting substrate material by means of the pulsed laser beam and allowing the molten substrate material to resolidify. The method further comprises removing substrate material along the at least one division line where the plurality of modified regions has been formed.

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