The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Feb. 25, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Roman Gouk, San Jose, CA (US);

Chintan Buch, Santa Clara, CA (US);

Kyuil Cho, Santa Clara, CA (US);

Han-Wen Chen, Cupertino, CA (US);

Steven Verhaverbeke, San Francisco, CA (US);

Vincent Dicaprio, Pleasanton, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); G03F 7/0002 (2013.01);
Abstract

The present disclosure generally relates to methods of micro-imprinting panels or substrates for advanced packaging applications. A redistribution layer comprising an epoxy material is deposited on a substrate layer and imprinted with a stamp to form an epoxy substrate patterned with a plurality of vias. The stamp is removed from the epoxy substrate, and the epoxy substrate is optionally etched with a plasma comprising oxygen to prevent the redistribution layer from becoming flowable when cured. A capping layer may optionally be deposited on the surface of the epoxy substrate.


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