The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Jul. 23, 2018
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Ya ping Chen, Chengdu, CN;

Hong Yang, Richardson, TX (US);

Peng Li, Chengdu, CN;

Seetharaman Sridhar, Richardson, TX (US);

Yunlong Liu, Chengdu, CN;

Rui Liu, Changdu, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/311 (2006.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 29/407 (2013.01); H01L 29/401 (2013.01); H01L 29/404 (2013.01); H01L 29/66734 (2013.01); H01L 29/7813 (2013.01); H01L 21/28035 (2013.01); H01L 21/28194 (2013.01); H01L 21/31111 (2013.01); H01L 21/31116 (2013.01);
Abstract

A semiconductor device includes a substrate including a semiconductor surface layer. A field plate (FP) includes a trench in the semiconductor surface layer filled with a single polysilicon layer positioned on at least one side of a power metal-oxide-semiconductor field effect transistor (power MOSFET). The power MOSFET includes a dielectric liner lining a sidewall of the trench under the polysilicon layer including a second dielectric liner on a first dielectric liner. An upper portion of the dielectric liner has a lower dielectric thickness as compared to a dielectric thickness on its lower portion. The single polysilicon layer extends continuously over the dielectric liner along both the lower portion and the upper portion. The power MOSFET includes a drain including a drain contact below a vertical drift region in the semiconductor surface layer, and a gate, body and a source above the vertical drift region.


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