The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Nov. 27, 2017
Win Semiconductors Corp., Tao Yuan, TW;
Chang-Hwang Hua, Tao Yuan, TW;
Yi-Wei Lien, Tao Yuan, TW;
WIN SEMICONDUCTORS CORP., Tao Yuan, TW;
Abstract
An ohmic metal for GaN device comprises a diffusion barrier seed metal layer and a plurality of metal layers. The diffusion barrier seed metal layer is formed on an epitaxial structure layer. The diffusion barrier seed metal layer is made of Pt. The epitaxial structure layer is made of AlGaN or GaN. The plurality of metal layers is formed on the diffusion barrier seed metal layer. The plurality of metal layers comprises a first metal layer and a second metal layer. The first metal layer is formed on the diffusion barrier seed metal layer. The first metal layer is made of Ti. The second metal layer is formed on the first metal layer. The second metal layer is made of Al. By the diffusion barrier seed metal layer, so as to suppress the diffusion of the plurality of metal layers into the epitaxial structure layer.