The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Oct. 02, 2018
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Wei Hong, Clifton Park, NY (US);

Hui Zang, Guilderland, NY (US);

Hsien-Ching Lo, Round Rock, TX (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/417 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 27/12 (2006.01); H01L 29/51 (2006.01); H01L 29/49 (2006.01); H01L 29/165 (2006.01); H01L 29/78 (2006.01); H01L 21/84 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 21/3105 (2006.01); H01L 21/762 (2006.01); H01L 21/027 (2006.01); H01L 21/28 (2006.01); H01L 21/285 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/41783 (2013.01); H01L 21/0217 (2013.01); H01L 21/0273 (2013.01); H01L 21/02164 (2013.01); H01L 21/31053 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/76283 (2013.01); H01L 21/76802 (2013.01); H01L 21/76829 (2013.01); H01L 21/76832 (2013.01); H01L 21/84 (2013.01); H01L 27/1207 (2013.01); H01L 29/0649 (2013.01); H01L 29/0847 (2013.01); H01L 21/0228 (2013.01); H01L 21/02181 (2013.01); H01L 21/02271 (2013.01); H01L 21/02274 (2013.01); H01L 21/02532 (2013.01); H01L 21/28035 (2013.01); H01L 21/28194 (2013.01); H01L 21/28525 (2013.01); H01L 29/165 (2013.01); H01L 29/4933 (2013.01); H01L 29/517 (2013.01); H01L 29/6656 (2013.01); H01L 29/7843 (2013.01);
Abstract

Structures for a field-effect transistor and methods for fabricating a structure for a field-effect transistor. First and second device structure are respectively formed in first and second device regions, and a first dielectric layer is formed over the first and second device regions. The first dielectric layer includes a recess defining a step at a transition between the first and second device regions, and a second dielectric layer is arranged within the recess in the first dielectric layer. A third dielectric layer is arranged over the first dielectric layer in the first device region and over the second dielectric layer in the second device region. A contact, which is coupled with the second device structure, extends through the first, second, and third dielectric layers in the second device region.


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