The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Jan. 23, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Jui-Fen Chien, Taichung, TW;

Hsiao-Kuan Wei, Taoyuan, TW;

Hsien-Ming Lee, Changhua, TW;

Chin-You Hsu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/49 (2006.01); H01L 29/78 (2006.01); H01L 27/092 (2006.01); H01L 29/66 (2006.01); H01L 21/28 (2006.01); H01L 29/165 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4966 (2013.01); H01L 21/28088 (2013.01); H01L 27/0924 (2013.01); H01L 29/0653 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/7848 (2013.01); H01L 29/165 (2013.01);
Abstract

Provided is a semiconductor device including a fin-type field effect transistor (FinFET). The first FinFET includes a first gate structure and the first gate structure includes a first work function layer. The first work function layer includes a first layer and a second layer. The first layer is disposed over the second layer. The second layer includes a base material and a dopant doped in the base material. The dopant comprises Al, Ta, W, or a combination thereof. The first layer and the second layer comprise different materials. A method of manufacturing the semiconductor device is also provided.


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