The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Sep. 24, 2015
Applicant:

Siltectra Gmbh, Dresden, DE;

Inventors:

Jan Richter, Dresden, DE;

Christian Beyer, Freiberg, DE;

Anas Ajaj, Dresden, DE;

Assignee:

Siltectra GmbH, Dresden, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 21/762 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0201 (2013.01); H01L 21/6836 (2013.01); H01L 21/76254 (2013.01); H01L 21/76259 (2013.01);
Abstract

The present invention relates to a method for producing solid body layers. The claimed method comprises at least the following steps: providing a solid body () for separating at least one solid body layer (), arranging a receiving layer () on the solid body for holding the solid body layer (), said receiving layer being made of at least one polymer and an additional material, said receiving layer, in terms of volume, be made mainly of polymer, the additional material having a greater conductivity than the polymer, and the receiving layer () is subjected to thermal stress, in particular, mechanical stress, for generating voltages in the solid body (), wherein a crack in the solid body () along a separation plane () expands due to the voltages, the solid layer () being separated from the solid body () due to the crack.


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