The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Dec. 13, 2017
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Hiroshi Morikazu, Tokyo, JP;

Karl Heinz Priewasser, Munich, DE;

Nao Hattori, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/04 (2014.01); H01L 21/78 (2006.01); H01L 21/76 (2006.01); B23K 26/042 (2014.01); B23K 26/53 (2014.01); B23K 26/03 (2006.01); B23K 26/046 (2014.01); B23K 26/55 (2014.01); B23K 26/0622 (2014.01); B23K 26/00 (2014.01); B23K 26/06 (2014.01); H01L 31/20 (2006.01); H01L 33/00 (2010.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/043 (2013.01); B23K 26/0006 (2013.01); B23K 26/0093 (2013.01); B23K 26/032 (2013.01); B23K 26/042 (2015.10); B23K 26/046 (2013.01); B23K 26/0613 (2013.01); B23K 26/0624 (2015.10); B23K 26/0648 (2013.01); B23K 26/53 (2015.10); B23K 26/55 (2015.10); H01L 21/76 (2013.01); H01L 21/78 (2013.01); H01L 31/202 (2013.01); H01L 33/007 (2013.01); B23K 2101/40 (2018.08); B23K 2103/52 (2018.08); B23K 2103/54 (2018.08); H01L 33/0095 (2013.01);
Abstract

A substrate has a first surface with at least one division line formed thereon and a second surface opposite the first surface. The substrate is processed by applying a pulsed laser beam from the side of the first surface. The substrate is transparent to the pulsed laser beam. The pulsed laser beam is applied at least in a plurality of positions along the at least one division line, a focal point of the pulsed laser beam located at a distance from the first surface in the direction from the first surface towards the second surface, so as to form a plurality of modified regions inside the substrate. Each modified region is entirely within the bulk of the substrate, without any openings open to the first surface or the second surface. Substrate material is removed along the at least one division line where the modified regions are present.


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