The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Oct. 10, 2018
Applicant:

Xcelsis Corporation, San Jose, CA (US);

Inventors:

Javier A. Delacruz, San Jose, CA (US);

Don Draper, San Jose, CA (US);

Jung Ko, San Jose, CA (US);

Steven L. Teig, Menlo Park, CA (US);

Assignee:

Xcelsis Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 27/118 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11807 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 2027/11838 (2013.01); H01L 2027/11875 (2013.01); H01L 2027/11879 (2013.01); H01L 2027/11881 (2013.01);
Abstract

The present disclosure provides chip architectures for FPGAs and other routing implementations that provide for increased memory with high bandwidth, in a reduced size, accessible with reduced latency. Such architectures include a first layer in advanced node and a second layer in legacy node. The first layer includes an active die, active circuitry, and a configurable memory, and the second layer includes a passive die with wiring. The second layer is bonded to the first layer such that the wiring of the second layer interconnects with the active circuitry of the first layer and extends an amount of wiring possible in the first layer.


Find Patent Forward Citations

Loading…