The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Nov. 01, 2018
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Wang Xiang, Singapore, SG;

Chia-Ching Hsu, Yunlin County, TW;

Chun-Sung Huang, Yuanlin, TW;

Yung-Lin Tseng, Xiushui Township, TW;

Wei-Chang Liu, Singapore, SG;

Shen-De Wang, Zhudong Township, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/115 (2017.01); H01L 27/11524 (2017.01); H01L 27/11565 (2017.01); H01L 27/11519 (2017.01); H01L 27/1157 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11524 (2013.01); H01L 27/1157 (2013.01); H01L 27/11519 (2013.01); H01L 27/11565 (2013.01);
Abstract

A memory structure including a substrate, at least one stacked gate structure, a first spacer conductive layer, and a first contact is provided. The stacked gate structure is located on the substrate and includes a control gate. The control gate extends in a first direction. The first spacer conductive layer is located on one sidewall of the control gate and is electrically insulated from the control gate. The first spacer conductive layer includes a first merged spacer portion and a first non-merged spacer portion. A line width of the first merged spacer portion is greater than a line width of the first non-merged spacer portion. The first contact is connected to the first merged spacer portion. The memory structure can have a larger process window of contact.


Find Patent Forward Citations

Loading…