The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Apr. 13, 2018
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Alexander Roth, Zeitlarn, DE;

Juergen Hoegerl, Regensburg, DE;

Hans-Joachim Schulze, Taufkirchen, DE;

Hans-Joerg Timme, Ottobrunn, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 25/18 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 25/16 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/4807 (2013.01); H01L 21/4825 (2013.01); H01L 21/4839 (2013.01); H01L 21/565 (2013.01); H01L 23/142 (2013.01); H01L 23/3731 (2013.01); H01L 23/3735 (2013.01); H01L 23/4952 (2013.01); H01L 23/49537 (2013.01); H01L 23/49575 (2013.01); H01L 23/49811 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 23/3107 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/49111 (2013.01);
Abstract

A module is disclosed. In one example, the module includes a carrier, an at least partially thermally conductive and electrically insulating body mounted on only a part of a main surface of the carrier, an at least partially electrically conductive redistribution structure on the thermally conductive and electrically insulating body, an electronic chip mounted on the redistribution structure and above the thermally conductive and electrically insulating body, and an encapsulant encapsulating at least part of the carrier, at least part of the thermally conductive and electrically insulating body, at least part of the redistribution structure, and at least part of the electronic chip.


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