The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Aug. 17, 2018
International Business Machines Corporation, Armonk, NY (US);
Stephen M. Hugo, Stewartville, MN (US);
Tim Bartsch, Stewartville, MN (US);
James D. Bielick, Pine Island, MN (US);
David J. Braun, St. Charles, MN (US);
John R. Dangler, Rochester, MN (US);
Theron L. Lewis, Rochester, MN (US);
Jennifer Bennett, Rochester, MN (US);
Timothy P. Younger, Rochester, MN (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
Fabrication of a reliable circuit board assembly with press-fit connectors is facilitated by identifying a press-fit-connector-to-circuit board connection of a circuit board assembly for testing, with one or more press-fit connector pins of the connector being press-fit into one or more corresponding plated through-holes of the circuit board at a first surface of the circuit board. An electrically insulative liquid is applied at a second surface of the circuit board to the corresponding plated through-hole(s) with the press-fit pin(s), where the second surface and the first surface are opposite surfaces of the circuit board. Connection of the press-fit pin(s) to the corresponding plated through-hole(s) is tested to identify a connection failure, where the electrically insulative liquid facilitates identifying the connection failure. A fabrication adjustment to the circuit board assembly can be identified and implemented to address the identified connection failure.