The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Apr. 18, 2017
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
ChunHung Chen, Youngjing, TW;
Sheng-Chen Wang, Taichung, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 53/017 (2012.01); B24B 49/12 (2006.01); B24B 49/16 (2006.01); B24B 49/18 (2006.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01); B24B 49/12 (2013.01); B24B 49/16 (2013.01); B24B 49/18 (2013.01);
Abstract
A chemical mechanical polishing apparatus including a conditioning head having a first pressure sensor and a controller configured to adjust at least one of a position or a rotation of the conditioning pad responsive to the first pressure data. The conditioning head is adjustable between a first position and a second position, the conditioning head and a polishing pad are in contact when the conditioning head is in the second position, and the first pressure sensor generates first pressure data when the conditioning head is in the second position.