The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Jul. 02, 2019
Applicant:
Stmicroelectronics, Inc., Calamba, PH;
Inventors:
Assignee:
STMICROELECTRONICS, INC., Calamba, PH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/60 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4952 (2013.01); H01L 21/4832 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 23/49548 (2013.01); H01L 23/60 (2013.01); H01L 22/12 (2013.01); H01L 23/3107 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2223/544 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49052 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/85013 (2013.01); H01L 2224/85424 (2013.01); H01L 2224/85447 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01);
Abstract
According to principles of the disclosure as explained herein, selected leads are electrically connected through metal strips to the lead frame until the end of the manufacturing process. The lead frame is grounded through the manufacturing process to prevent any ESD event from causing damage to the protected leads. In the final singulation step, the leads are electrically isolated from each other and from the lead frame, thus maintaining protection from a potential ESD event up until the final package singulation step.