The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Nov. 01, 2018
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Yu-Chun Chen, Kaohsiung, TW;

Ya-Sheng Feng, Tainan, TW;

Chiu-Jung Chiu, Tainan, TW;

Hung-Chan Lin, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/02 (2006.01); H01F 10/32 (2006.01); H01L 23/535 (2006.01); H01L 43/12 (2006.01); H01F 41/34 (2006.01); H01L 27/22 (2006.01); H01L 43/10 (2006.01); G11C 11/16 (2006.01);
U.S. Cl.
CPC ...
H01L 43/02 (2013.01); H01L 23/535 (2013.01); H01L 27/222 (2013.01); H01L 43/12 (2013.01); G11C 11/161 (2013.01); H01L 43/10 (2013.01);
Abstract

A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the MTJ, and a second spacer on another side of the MTJ, wherein the first spacer and the second spacer are asymmetric. Specifically, the MTJ further includes a first bottom electrode disposed on a metal interconnection, a capping layer on the bottom electrode, and a top electrode on the capping layer, in which a top surface of the first spacer is even with a top surface of the top electrode and a top surface of the second spacer is lower than the top surface of the top electrode and higher than the top surface of the capping layer.


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