The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
May. 18, 2017
Applicant:
Taiwan Semiconductor Manufacturing, Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacutring Co., Ltd., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4966 (2013.01); H01L 21/28105 (2013.01); H01L 29/4983 (2013.01); H01L 29/66545 (2013.01); H01L 29/66871 (2013.01); H01L 29/78 (2013.01);
Abstract
The present disclosure describes an exemplary replacement gate process that forms spacer layers in a gate stack to mitigate time dependent dielectric breakdown (TDDB) failures. For example, the method can include a partially fabricated gate structure with a first recess. A spacer layer is deposited into the first recess and etched with an anisotropic etchback (EB) process to form a second recess that has a smaller aperture than the first recess. A metal fill layer is deposited into the second recess.