The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Oct. 02, 2018
Applicant:
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
Inventors:
Assignee:
GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/482 (2006.01); H01L 23/485 (2006.01); H01L 23/31 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 21/28 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 21/28247 (2013.01); H01L 21/30655 (2013.01); H01L 21/76802 (2013.01); H01L 23/3178 (2013.01); H01L 23/485 (2013.01); H01L 23/4824 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01);
Abstract
According to an aspect of the present disclosure, a semiconductor device is provided that includes a substrate, at least one bond pad, a passivation layer and a NBLoK layer. The bond pad is formed over the substrate. The passivation layer is deposited over the substrate and has an opening defined by end portions of the passivation layer over the bond pad. The NBLoK layer is covering the end portions of the passivation layer.
Quick Actions:
Li, Xiaodong. (2020). Bond pad reliability of semiconductor devices (U.S. Patent No. 10658316). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10658316
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile