The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Sep. 29, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Rahul N. Manepalli, Chandler, AZ (US);

Kousik Ganesan, Chandler, AZ (US);

Marcel Arlan Wall, Phoenix, AZ (US);

Srinivas Pietambaram, Gilbert, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01); C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); C25D 3/38 (2013.01); C25D 5/022 (2013.01); C25D 7/123 (2013.01); H01L 21/4846 (2013.01); H01L 21/4857 (2013.01); H01L 23/498 (2013.01); H01L 23/49822 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H05K 1/0306 (2013.01); H05K 1/0353 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/10 (2013.01); H01L 2223/6616 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/18161 (2013.01);
Abstract

According to various embodiments of the present disclosure, a substrate for an integrated circuit includes a dielectric layer. The substrate further includes a conductive layer extending in an x or y direction. The conductive layer is at least partially embedded within the dielectric layer. The conductive layer includes a via having a first end and an opposite second end. The via has a first height in a z-direction and a constant cross-sectional shape between the first end and the second end. A trace is adjacent to the via and has a second height in the z-direction that is different than the first height.


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