The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Oct. 30, 2018
Nxp Usa, Inc., Austin, TX (US);
NXP USA, Inc., Austin, TX (US);
Abstract
A shielded semiconductor device is assembled using a lead frame having a die receiving area, leads disposed around the die receiving area, and a bendable strip formed in the die receiving area. Each lead has an inner lead end that is spaced from but near to one of the sides of the die receiving area and an outer lead end that is distal to that side of the die receiving area. An IC die is attached to the die receiving area and electrically connected to the inner lead ends of the leads. An encapsulant is formed over the die and the electrical connections and forms a body. The strip is bent to extend vertically to a top side of the body. A lid is formed on the top side of the body and is in contact with a distal end of the vertical strip.