The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Dec. 14, 2018
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Jianjun Yang, Singapore, SG;

Cheng-Hua Yang, Hsinchu, TW;

Fan-Chi Meng, Hsinchu, TW;

Chih-Chien Chang, Hsinchu, TW;

Shen-De Wang, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 27/11517 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11517 (2013.01);
Abstract

A manufacturing method of a semiconductor device includes: providing a substrate having memory and high voltage regions; sequentially forming a floating gate layer and a hard mask layer on the substrate; patterning the hard mask layer to form a first opening exposing a portion of the floating gate layer in the range of the memory region; patterning the hard mask layer and the floating gate layer to form a second opening overlapped with the high voltage region; performing a first thermal growth process to simultaneously form a first oxide structure on the portion of the floating gate layer exposed by the first opening, and to form a second oxide structure on a portion of the substrate overlapped with the second opening; removing the hard mask layer; and patterning the floating gate layer by using the first oxide structure as a mask.


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