The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Nov. 15, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
David W. Abraham, Croton, NY (US);
John M. Cotte, New Fairfield, CT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/00 (2006.01); G01R 31/28 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); G01R 1/04 (2006.01); G01R 31/317 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); G01R 1/0483 (2013.01); G01R 31/2884 (2013.01); G01R 31/2886 (2013.01); G01R 31/2889 (2013.01); G01R 31/2894 (2013.01); G01R 31/31713 (2013.01); H01L 21/02057 (2013.01); H01L 21/67271 (2013.01); H01L 22/20 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); G01R 1/0466 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0567 (2013.01); H01L 2224/0568 (2013.01); H01L 2224/05099 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05605 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05617 (2013.01); H01L 2224/05618 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05663 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05672 (2013.01); H01L 2224/05676 (2013.01); H01L 2224/05678 (2013.01); H01L 2224/05679 (2013.01); H01L 2224/05681 (2013.01); H01L 2224/05683 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/14 (2013.01);
Abstract
Semiconductor devices and electronics packaging methods include integrated circuit chips having redundant signal bond pads along with signal bond pads connected to the same signal port for non-destructive testing of the integrated circuit chips prior to packaging. Electrical testing is made via the redundant signal bond after which qualified integrated circuit chips can be attached to a pristine and bumped final interposer or printed circuit board to provide increased reliability to the assembled electronic package.