The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Oct. 05, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Robert L. Sankman, Phoenix, AZ (US);
John S. Guzek, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 23/64 (2006.01); H01L 25/16 (2006.01); H01L 21/50 (2006.01); H01L 23/522 (2006.01); H01L 21/3105 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 21/31053 (2013.01); H01L 21/50 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/3107 (2013.01); H01L 23/522 (2013.01); H01L 23/5389 (2013.01); H01L 23/64 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 21/568 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/19 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/96 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A reconstituted wafer includes a rigid mass with a flat surface and a base surface disposed parallel planar to the flat surface. A plurality of dice are embedded in the rigid mass. The plurality of dice include terminals that are exposed through coplanar with the flat surface. A process of forming the reconstituted wafer includes removing some of the rigid mass to expose the terminals, while retaining the plurality of dice in the rigid mass. A process of forming an apparatus includes separating one apparatus from the reconstituted wafer.