The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Dec. 19, 2014
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Chloe Baldasseroni, Portland, OR (US);

Andrew Duvall, Portland, OR (US);

Ryan Blaquiere, Portland, OR (US);

Shankar Swaminathan, Beaverton, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/683 (2006.01); C23C 16/458 (2006.01); C23C 14/50 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4585 (2013.01); H01J 37/32623 (2013.01); H01L 21/68735 (2013.01); H01L 21/68785 (2013.01);
Abstract

A process chamber for depositing a film on a wafer is provided, including: a pedestal having, a central top surface having a plurality of wafer supports configured to support the wafer at a support level above the central top surface, an annular surface at a step down from the central top surface; a carrier ring configured to be supported by carrier ring supports such that a bottom surface of the carrier ring is at a first vertical separation above the annular surface, the carrier ring having a step down surface defined relative to a top surface; wherein when the carrier ring is seated on the carrier ring supports, then the step down surface of the carrier ring is positioned at a process level that is at a second vertical separation from the support level over the top surface of the pedestal.


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