The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Mar. 31, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Youngseok Oh, Portland, OR (US);
Justin M Huttula, Hillsboro, OR (US);
Mohanraj Prabhugoud, Hillsboro, OR (US);
Ronald Kirby, Portland, OR (US);
Joe Walczyk, Tigard, OR (US);
Erkan Acar, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H01R 13/6594 (2011.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); H01R 12/71 (2011.01); H01R 13/24 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6594 (2013.01); G01R 1/045 (2013.01); G01R 1/06722 (2013.01); H01R 12/714 (2013.01); H01R 13/2435 (2013.01); H01R 2201/20 (2013.01); Y10T 29/5313 (2015.01);
Abstract
A shielded interconnect array and associated methods are described. Examples of the shielded interconnect array include socket connections that include conductive members with flexible bends. In examples shown, corresponding grounded conductive members with flexible bends are located adjacent to other conductive members with flexible bends to provide shielding.