The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

May. 08, 2018
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Wen Hung Huang, Kaohsiung, TW;

Chien-Mei Huang, Kaohsiung, TW;

Yan Wen Chung, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/486 (2013.01); H01L 23/49866 (2013.01); H01L 24/03 (2013.01); H01L 24/08 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/0401 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01);
Abstract

A wiring structure includes an insulating layer and a conductive structure. The insulating layer has an upper surface and a lower surface opposite to the upper surface, and defines an opening extending through the insulating layer. The conductive structure is disposed in the opening of the insulating layer, and includes a first barrier layer and a wetting layer. The first barrier layer is disposed on a sidewall of the opening of the insulating layer, and defines a through hole extending through the first barrier layer. The wetting layer is disposed on the first barrier layer. A portion of the wetting layer is exposed from the through hole of the first barrier layer and the lower surface of the insulating layer to form a ball pad.


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