The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Oct. 27, 2017
Applicant:

Asm Ip Holding B.v., Almere, NL;

Inventors:

Qi Xie, Leuven, BE;

Michael Eugen Givens, Scottsdale, AZ (US);

Petri Raisanen, Gilbert, AZ (US);

Jan Willem Maes, Wilrijk, BE;

Assignee:

ASM IP Holdings B.V., Almere, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 21/8238 (2006.01); H01L 29/78 (2006.01); H01L 21/285 (2006.01); H01L 21/3213 (2006.01); H01L 27/092 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 29/423 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823842 (2013.01); H01L 21/28088 (2013.01); H01L 21/28556 (2013.01); H01L 21/32133 (2013.01); H01L 21/823857 (2013.01); H01L 27/092 (2013.01); H01L 29/4966 (2013.01); H01L 29/66545 (2013.01); H01L 29/78 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/823821 (2013.01); H01L 27/0924 (2013.01); H01L 29/42364 (2013.01); H01L 29/517 (2013.01); H01L 29/6656 (2013.01);
Abstract

Methods for forming a semiconductor device and related semiconductor device structures are provided. In some embodiments, methods may include forming an NMOS gate dielectric and a PMOS gate dielectric over a substrate and forming a first work function metal over the NMOS gate dielectric and over the PMOS gate dielectric. In some embodiments, methods may also include, removing the first work function metal over the NMOS gate dielectric and forming a second work function metal over the NMOS gate dielectric and over the PMOS gate dielectric. In some embodiments, related semiconductor device structures may include an NMOS gate dielectric and a PMOS gate dielectric disposed over a semiconductor substrate. A PMOS gate electrode may be disposed over the PMOS gate dielectric and the PMOS gate electrode may include a first work function metal disposed over the PMOS gate dielectric and a second work function metal disposed over the first work function metal. A NMOS gate electrode may be disposed over the NMOS gate dielectric and the NMOS gate electrode may include the second work function metal.


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