The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Aug. 30, 2017
Applicant:

Beijing Naura Microelectronics Equipment Co., Ltd, Beijing, CN;

Inventors:

Jun Wang, Beijing, CN;

Boyu Dong, Beijing, CN;

Bingliang Guo, Beijing, CN;

Yujie Geng, Beijing, CN;

Huaichao Ma, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01L 21/02 (2006.01); C23C 14/06 (2006.01); C30B 29/40 (2006.01); C30B 23/02 (2006.01); C23C 14/00 (2006.01); C23C 14/56 (2006.01); H01L 33/00 (2010.01); H01L 33/12 (2010.01); H01L 33/32 (2010.01); H01L 33/06 (2010.01);
U.S. Cl.
CPC ...
H01L 21/02631 (2013.01); C23C 14/0036 (2013.01); C23C 14/0617 (2013.01); C23C 14/0641 (2013.01); C23C 14/34 (2013.01); C23C 14/3485 (2013.01); C23C 14/564 (2013.01); C30B 23/025 (2013.01); C30B 29/403 (2013.01); H01L 21/0242 (2013.01); H01L 21/0254 (2013.01); H01L 21/02458 (2013.01); H01L 33/007 (2013.01); H01L 33/06 (2013.01); H01L 33/12 (2013.01); H01L 33/32 (2013.01);
Abstract

The present disclosure provides a film forming method and an aluminum nitride film forming method for a semiconductor device. The film forming method for a semiconductor device includes performing multiple sputtering routes sequentially. Each sputtering routes includes: loading a substrate into a chamber; moving a shielding plate between a target and the substrate; introducing an inert gas into the chamber to perform a surface modification process on the target; performing a pre-sputtering to pre-treat a surface of the target; moving the shielding plate away from the substrate, and performing a main sputtering on the substrate to form a film on the substrate; and moving the substrate out of the chamber.


Find Patent Forward Citations

Loading…