The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Aug. 13, 2018
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Bencherki Mebarki, Santa Clara, CA (US);
Sean S. Kang, San Ramon, CA (US);
Keith Tatseun Wong, Los Gatos, CA (US);
He Ren, San Jose, CA (US);
Mehul B. Naik, San Jose, CA (US);
Ellie Y. Yieh, Sunnyvale, CA (US);
Srinivas D. Nemani, Sunnyvale, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76882 (2013.01); H01L 21/76883 (2013.01); H01L 23/53209 (2013.01); H01L 23/53214 (2013.01); H01L 23/53257 (2013.01);
Abstract
Aspects of the disclosure include methods of treating a substrate to remove one or more of voids, seams, and grain boundaries from interconnects formed on the substrate. The method includes heating the substrate in an environment pressurized at supra-atmospheric pressure. In one example, the substrate may be heated in a hydrogen-containing atmosphere.