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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10636691 B1

PDFFull Text
Date of Patent:
Apr. 28, 2020

Filed:

Mar. 22, 2017

Semiconductor processing sheet

Applicant:

Lintec Corporation, Itabashi-ku, JP;

Inventors:

Takashi Akutsu, Saitama, JP;

Takuo Nishida, Munich, DE;

Assignee:

LINTEC Corporation, Itabashi-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Michael Zhang

Int. Cl.
CPC ...
H01L 21/683 (2006.01); C09J 5/00 (2006.01); C08L 33/08 (2006.01); B32B 25/08 (2006.01); C09J 133/26 (2006.01); C09J 7/22 (2018.01); B32B 27/32 (2006.01); B32B 27/30 (2006.01); B32B 7/06 (2019.01); C09J 7/38 (2018.01); B32B 23/08 (2006.01); B32B 27/36 (2006.01); C09J 133/06 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/40 (2006.01); B32B 27/16 (2006.01); B32B 7/12 (2006.01); B32B 27/06 (2006.01); C09J 133/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 23/08 (2013.01); B32B 25/08 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/286 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/325 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 27/40 (2013.01); C08L 33/08 (2013.01); C09J 5/00 (2013.01); C09J 7/22 (2018.01); C09J 7/38 (2018.01); C09J 133/064 (2013.01); C09J 133/08 (2013.01); C09J 133/26 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2307/732 (2013.01); B32B 2307/748 (2013.01); B32B 2457/14 (2013.01); C09J 2201/606 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2205/302 (2013.01); C09J 2205/31 (2013.01); C09J 2433/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract

The semiconductor processing sheet of the present invention is a semiconductor processing sheet including a base material and a pressure sensitive adhesive layer provided on one surface of the base material, wherein the pressure sensitive adhesive layer contains an acrylic polymer (A) having a molecular weight distribution of 3.0 or less and an acrylic polymer (B) having a molecular weight distribution of more than 3.0; and a gel fraction of the pressure sensitive adhesive layer is 50 to 70%, and a number average molecular weight of a sol content thereof is 60,000 or more.

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Akutsu, Takashi. (2020). Semiconductor processing sheet (U.S. Patent No. 10636691). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10636691

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