The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Jan. 14, 2019
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Yihong Chen, San Jose, CA (US);
Rui Cheng, Santa Clara, CA (US);
Pramit Manna, Santa Clara, CA (US);
Abhijit Basu Mallick, Fremont, CA (US);
Shishi Jiang, Santa Clara, CA (US);
Yong Wu, Mountain View, CA (US);
Kurtis Leschkies, San Jose, CA (US);
Srinivas Gandikota, Santa Clara, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/3105 (2006.01); H01L 21/02 (2006.01); C23C 16/56 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); G06F 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31051 (2013.01); C23C 16/56 (2013.01); G06F 1/00 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/02211 (2013.01); H01L 21/02271 (2013.01); H01L 21/02323 (2013.01); H01L 21/02337 (2013.01); H01L 21/6719 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/67126 (2013.01); H01L 21/68742 (2013.01); H01L 21/68771 (2013.01); H01L 21/67248 (2013.01);
Abstract
Aspects of the disclosure include methods of processing a substrate. The method includes depositing a conformal layer on a substrate which contains seams. The substrate is treated using a high pressure anneal in the presence of an oxidizer.