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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10633736 B1

PDFFull Text
Date of Patent:
Apr. 28, 2020

Filed:

Dec. 12, 2017

Film formation apparatus

Applicant:

Shibaura Mechatronics Corporation, Yokohama-shi, Kanagawa, JP;

Inventors:

Akihiko Ito, Yokohama, JP;

Yoshinao Kamo, Yokohama, JP;

Shigeki Matsunaka, Yokohama, JP;

Atsushi Fujita, Yokohama, JP;

Assignee:

SHIBAURA MECHATRONICS CORPORATION, Yokohama-Shi, Kanagawa, JP;

Attorneys:

Nath, Goldberg & Meyer

Jerald L. Meyer

Stanley N. Protigal

Primary Examiner:

Binu Thomas

Int. Cl.
CPC ...
C23C 14/50 (2006.01); C23C 16/458 (2006.01); H01J 37/32 (2006.01); H01L 21/687 (2006.01); C23C 14/34 (2006.01); H01L 21/56 (2006.01); H01J 37/34 (2006.01); H01L 23/00 (2006.01); H01L 23/552 (2006.01); C23C 14/18 (2006.01); C23C 14/54 (2006.01); C23C 14/02 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3464 (2013.01); C23C 14/022 (2013.01); C23C 14/185 (2013.01); C23C 14/34 (2013.01); C23C 14/505 (2013.01); C23C 14/541 (2013.01); C23C 16/458 (2013.01); H01J 37/32 (2013.01); H01J 37/32715 (2013.01); H01J 37/34 (2013.01); H01J 37/3429 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/67132 (2013.01); H01L 21/6835 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01); H01L 21/68778 (2013.01); H01L 23/552 (2013.01); H01L 24/97 (2013.01); H01L 23/3121 (2013.01); H01L 2221/68313 (2013.01);
Abstract

A film formation apparatus includes a carrying unit circulating and carrying an electronic component in a sputtering chamber, a film formation processing unit including a mount surface and a mount member which is mounted on the mount surface, and on which the electronic component is placed. The mount member includes a holding sheet having an adhesive surface, and a non-adhesive surface, and a sticking sheet having a first sticking surface with adhesiveness sticking to the non-adhesive surface, and a second sticking surface with adhesiveness sticking to the mount surface of the tray. The adhesive surface includes a pasting region for pasting the electronic components. The first sticking surface sticks across an entire region of the non-adhesive surface corresponding to at least the pasting region to provide a file formation apparatus which employs a simple structure that is capable of suppressing heating of electronic components.

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