The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Jul. 05, 2017
Applicant:

Inevit Llc, Redwood City, CA (US);

Inventors:

Heiner Fees, Bietigheim-Bissingen, DE;

Andreas Track, Sachsenheim, DE;

Alexander Eichhorn, Eppingen, DE;

Ralf Maisch, Abstatt, DE;

Jörg Damaske, Freiberg, DE;

Martin Eberhard, Woodside, CA (US);

Assignee:

TIVENI MERGECO, INC., San Mateo, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/20 (2006.01); H01M 2/24 (2006.01); B23K 26/21 (2014.01); B60L 50/64 (2019.01); B60L 58/21 (2019.01); H01M 2/02 (2006.01); H01M 2/04 (2006.01); H01M 2/10 (2006.01); H01M 2/30 (2006.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); B23K 26/26 (2014.01); H01M 2/22 (2006.01); B23K 101/36 (2006.01); H01M 10/643 (2014.01); H01M 10/6552 (2014.01); B23K 101/38 (2006.01); H01M 2/34 (2006.01); B60K 1/00 (2006.01);
U.S. Cl.
CPC ...
H01M 2/206 (2013.01); B23K 26/21 (2015.10); B23K 26/26 (2013.01); B60L 50/64 (2019.02); B60L 58/21 (2019.02); H01M 2/022 (2013.01); H01M 2/023 (2013.01); H01M 2/027 (2013.01); H01M 2/0237 (2013.01); H01M 2/0262 (2013.01); H01M 2/0267 (2013.01); H01M 2/043 (2013.01); H01M 2/046 (2013.01); H01M 2/0413 (2013.01); H01M 2/1077 (2013.01); H01M 2/22 (2013.01); H01M 2/24 (2013.01); H01M 2/30 (2013.01); H01M 2/305 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); B23K 2101/36 (2018.08); B23K 2101/38 (2018.08); B60K 2001/005 (2013.01); H01M 2/34 (2013.01); H01M 10/643 (2015.04); H01M 10/6552 (2015.04); H01M 2200/103 (2013.01); H01M 2220/20 (2013.01);
Abstract

Embodiments are directed to a contact plate configured to establish electrical bonds between battery cells in a battery module. In a first embodiment, the contact plate includes at least one primary conductive layer, wherein the contact plate is configured to exchange current with at least one group of battery cells in the battery module, and wherein a thickness of the at least one primary conductive layer scales with a current expectation at different portions of the contact plate. In a second embodiment, the contact plate includes at least one primary conductive layer, and a set of bonding connectors that is configured to provide direct electrical bonds between the contact plate and terminals of at least one group of battery cells, wherein the set of bonding connectors is pre-assembled with the contact plate before the contact plate is installed into the battery module.


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