The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Jun. 04, 2018
Applicant:

Marvell World Trade Ltd., St. Michael, BB;

Inventors:

David Ganapol, Scotts Valley, CA (US);

Michael Gonia, San Jose, CA (US);

Scott Wu, San Jose, CA (US);

Marc Jacobs, Redwood City, CA (US);

Assignee:

Marvell Asia Pte, Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 1/073 (2006.01); G01R 35/00 (2006.01); G01R 31/28 (2006.01); G01R 1/04 (2006.01); G01R 3/00 (2006.01); G01R 31/26 (2020.01);
U.S. Cl.
CPC ...
G01R 1/07307 (2013.01); G01R 1/0408 (2013.01); G01R 31/2808 (2013.01); G01R 31/2886 (2013.01); G01R 31/2887 (2013.01); G01R 31/2889 (2013.01); G01R 31/2891 (2013.01); G01R 31/2893 (2013.01); G01R 35/00 (2013.01); G01R 1/07342 (2013.01); G01R 3/00 (2013.01); G01R 31/2601 (2013.01); G01R 31/287 (2013.01); G01R 31/2884 (2013.01);
Abstract

A probe card for testing dies of a substrate during a wafer sort process includes a printed circuit board (PCB) and a test site arranged to connect respectively to one of the dies during a test cycle. The test site includes a first pin connecting band and a first pin set. The first pin connecting band is connected to the PCB. The first pin set is connected to the first pin connecting band and includes a pin configuration for a testing device to perform a first type of test on a first die. The test site includes only pins in the first pin set. A number of pins in the first pin set is less than a number of pins used to perform a second type of test on the first die. The second type of test is performed at a slower processing speed than the first type of test.


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