The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

May. 08, 2018
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Martin C. Roberts, Boise, ID (US);

Sanh D. Tang, Kuna, ID (US);

Fred D. Fishburn, Hiroshima, JP;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 49/02 (2006.01); H01L 23/528 (2006.01); H01L 29/423 (2006.01); H01L 27/11504 (2017.01); H01L 27/11507 (2017.01); H01L 27/11514 (2017.01); H01L 21/28 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10805 (2013.01); H01L 23/528 (2013.01); H01L 27/1085 (2013.01); H01L 27/10873 (2013.01); H01L 27/10882 (2013.01); H01L 27/10897 (2013.01); H01L 27/11504 (2013.01); H01L 27/11507 (2013.01); H01L 27/11514 (2013.01); H01L 28/60 (2013.01); H01L 29/0847 (2013.01); H01L 29/1033 (2013.01); H01L 29/42376 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/02532 (2013.01); H01L 21/02595 (2013.01); H01L 21/28035 (2013.01); H01L 21/30604 (2013.01); H01L 21/31111 (2013.01); H01L 21/32134 (2013.01); H01L 27/0688 (2013.01);
Abstract

A memory array comprises vertically-alternating tiers of insulative material and memory cells. The memory cells individually include a transistor comprising first and second source/drain regions having a channel region there-between and a gate operatively proximate the channel region. At least a portion of the channel region is horizontally-oriented for horizontal current flow in the portion between the first and second source/drain regions. The memory cells individually include a capacitor comprising first and second electrodes having a capacitor insulator there-between. The first electrode is electrically coupled to the first source/drain region. The second capacitor electrodes of multiple of the capacitors in the array are electrically coupled with one another. A sense-line structure extends elevationally through the vertically-alternating tiers. Individual of the second source/drain regions of individual of the transistors that are in different memory cell tiers are electrically coupled to the elevationally-extending sense-line structure. Additional embodiments are disclosed.


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