The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Aug. 29, 2016
Applicants:

Mitsubishi Materials Corporation, Tokyo, JP;

The University of Tokyo, Tokyo, JP;

Inventors:

Yoshirou Kuromitsu, Saitama, JP;

Kazuhiro Akiyama, Naka-gun, JP;

Toshiyuki Nagase, Kawagoe, JP;

Yoshiyuki Nagatomo, Saitama, JP;

Nobuyuki Terasaki, Saitama, JP;

Yuichi Ikuhara, Tokyo, JP;

Naoya Shibata, Tokyo, JP;

Akihito Kumamoto, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/36 (2006.01); H01L 23/12 (2006.01); C04B 37/02 (2006.01); B23K 1/00 (2006.01); B23K 35/02 (2006.01); B23K 35/28 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); B23K 1/0016 (2013.01); B23K 35/0238 (2013.01); B23K 35/286 (2013.01); C04B 37/02 (2013.01); H01L 23/12 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 2224/32225 (2013.01);
Abstract

The present invention provides a ceramic-aluminum bonded body in which Mg-containing oxide having a spinel crystal structure are dispersed in an aluminum member within a range of 2 μm in a thickness direction from a bonded interface with a ceramic member, a segregated portion in which Mg, Si, and O is segregated is formed in the aluminum member in the vicinity of the bonded interface with the ceramic member, mass ratios of Mg, Si, and O between the segregated portion and a position spaced by 10 μm from the bonded interface toward an aluminum member side are within predetermined ranges, and the amount of Mg at the position spaced by 10 μm from the bonded interface toward the aluminum member side is 0.8 mass % or less.


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