The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Oct. 05, 2018
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Frances Hill, Sunnyvale, CA (US);
Gildardo R. Delgado, Livermore, CA (US);
Rudy F. Garcia, Union City, CA (US);
Michael E. Romero, San Jose, CA (US);
Katerina Ioakeimidi, San Francisco, CA (US);
Assignee:
KLA-Tencor Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 1/304 (2006.01); H01J 37/073 (2006.01); H01J 37/26 (2006.01); G02B 27/09 (2006.01); H01J 40/06 (2006.01); H01J 40/18 (2006.01); H01J 19/24 (2006.01); H01J 37/06 (2006.01); H01J 37/28 (2006.01); H01J 1/34 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01J 37/073 (2013.01); G02B 27/0927 (2013.01); H01J 1/3044 (2013.01); H01J 19/24 (2013.01); H01J 37/06 (2013.01); H01J 37/26 (2013.01); H01J 37/28 (2013.01); H01J 40/06 (2013.01); H01J 40/18 (2013.01); H01J 1/34 (2013.01); H01J 2201/308 (2013.01); H01J 2201/3048 (2013.01); H01J 2201/30411 (2013.01); H01J 2201/30449 (2013.01); H01J 2201/3423 (2013.01); H01J 2201/3425 (2013.01); H01J 2201/3426 (2013.01); H01J 2237/06333 (2013.01); H01J 2237/24521 (2013.01); H01J 2237/24592 (2013.01); H01J 2237/2817 (2013.01); H01L 21/67288 (2013.01);
Abstract
Electron source designs are disclosed. The emitter structure, which may be silicon, has a layer on it. The layer may be graphene or a photoemissive material, such as an alkali halide. An additional layer between the emitter structure and the layer or a protective layer on the layer can be included. Methods of operation and methods of manufacturing also are disclosed.