The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Jul. 05, 2017
Applicant:

Inevit Llc, Redwood City, CA (US);

Inventors:

Heiner Fees, Bietigheim-Bissingen, DE;

Andreas Track, Sachsenheim, DE;

Alexander Eichhorn, Eppingen, DE;

Ralf Maisch, Abstatt, DE;

Jörg Damaske, Freiberg, DE;

Martin Eberhard, Woodside, CA (US);

Assignee:

TIVENI MERGECO, INC., San Mateo, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/02 (2006.01); H01M 2/20 (2006.01); B23K 26/21 (2014.01); B60L 50/64 (2019.01); B60L 58/21 (2019.01); H01M 2/02 (2006.01); H01M 2/04 (2006.01); H01M 2/10 (2006.01); H01M 2/24 (2006.01); H01M 2/30 (2006.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); B23K 26/26 (2014.01); H01M 2/22 (2006.01); B23K 101/36 (2006.01); H01M 10/643 (2014.01); H01M 10/6552 (2014.01); B23K 101/38 (2006.01); H01M 2/34 (2006.01); B60K 1/00 (2006.01);
U.S. Cl.
CPC ...
H01M 2/206 (2013.01); B23K 26/21 (2015.10); B23K 26/26 (2013.01); B60L 50/64 (2019.02); B60L 58/21 (2019.02); H01M 2/022 (2013.01); H01M 2/023 (2013.01); H01M 2/027 (2013.01); H01M 2/0237 (2013.01); H01M 2/0262 (2013.01); H01M 2/0267 (2013.01); H01M 2/043 (2013.01); H01M 2/046 (2013.01); H01M 2/0413 (2013.01); H01M 2/1077 (2013.01); H01M 2/22 (2013.01); H01M 2/24 (2013.01); H01M 2/30 (2013.01); H01M 2/305 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); B23K 2101/36 (2018.08); B23K 2101/38 (2018.08); B60K 2001/005 (2013.01); H01M 2/34 (2013.01); H01M 10/643 (2015.04); H01M 10/6552 (2015.04); H01M 2200/103 (2013.01); H01M 2220/20 (2013.01);
Abstract

Embodiments are directed to a center contact plate configured to establish electrical bonds between battery cells in a battery module. In an embodiment, the center contact plate includes at least one primary conductive layer including a first set of holes formed within the at least one primary conductive layer that are aligned with positive terminals of a first group of battery cells that are configured to be connected in parallel with each other, and a second set of holes formed within the at least one primary conductive layer that are aligned with negative terminals of a second group of battery cells that are configured to be connected in parallel with each other, wherein the first and second sets of holes are each clustered together on different sides of the at least one primary conductive layer.


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