The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
May. 14, 2018
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Eiichi Nakano, Boise, ID (US);
Shiro Uchiyama, Hino Tokyo, JP;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/02 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 23/367 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/367 (2013.01); H01L 23/481 (2013.01); H01L 23/5384 (2013.01); H01L 25/50 (2013.01);
Abstract
A semiconductor device assembly, including an interposer comprising a glass material, a semiconductor die comprising a proximity coupling on a side of the interposer, and at least one other semiconductor die comprising a proximity coupling configured for communicating signals with the proximity coupling of the semiconductor die, on an opposing side of the interposer. The assembly may optionally be configured for optical signal communication with higher level packaging. Semiconductor device packages, systems and methods of operation are also disclosed.