The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Aug. 08, 2017
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Assignee:
KLA-Tencor Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G01N 23/2251 (2018.01); H01L 21/66 (2006.01); G01N 21/956 (2006.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
G01N 23/2251 (2013.01); H01L 22/20 (2013.01); G01N 21/9501 (2013.01); G01N 21/95607 (2013.01); G01N 2021/8867 (2013.01); H01L 22/12 (2013.01);
Abstract
Information from metrology tools can be used during inspection or review with a scanning electron microscope. Metrology measurements of a wafer are interpolated and/or extrapolated over a field, which creates modified metrology data. The modified metrology data is associated with defect attributes from inspection measurements of a wafer. A wafer review sampling plan is generated based on the defect attributes and the modified metrology data. The wafer review sampling plan can be used during review of a wafer using the scanning electron microscope.