The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Jun. 20, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Adel A. Elsherbini, Chandler, AZ (US);

Ravindranath Mahajan, Chandler, AZ (US);

John S. Guzek, Chandler, AZ (US);

Nitin A. Deshpande, Chandler, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H05K 1/14 (2006.01); H01L 23/552 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H01L 25/065 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/147 (2013.01); H01L 23/13 (2013.01); H01L 23/49833 (2013.01); H01L 23/552 (2013.01); H01L 25/50 (2013.01); H05K 1/0218 (2013.01); H01L 25/0655 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3025 (2013.01); H05K 3/361 (2013.01); H05K 2201/09245 (2013.01); H05K 2201/09681 (2013.01); Y10T 29/49126 (2015.01);
Abstract

Embodiments of the present disclosure are directed towards electro-magnetic interference (EMI) shielding techniques and configurations. In one embodiment, an apparatus includes a first substrate, a die having interconnect structures coupled with the first substrate to route input/output (I/O) signals between the die and the first substrate and a second substrate coupled with the first substrate, wherein the die is disposed between the first substrate and the second substrate and at least one of the first substrate and the second substrate include traces configured to provide electro-magnetic interference (EMI) shielding for the die. Other embodiments may be described and/or claimed.


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