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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10578968 B1

PDFFull Text
Date of Patent:
Mar. 03, 2020

Filed:

Mar. 27, 2017

Pattern forming method, resist pattern, and process for producing electronic device

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Kei Yamamoto, Haibara-gun, JP;

Naohiro Tango, Haibara-gun, JP;

Naoki Inoue, Haibara-gun, JP;

Michihiro Shirakawa, Haibara-gun, JP;

Akiyoshi Goto, Haibara-gun, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Kathleen Duda

Int. Cl.
CPC ...
G03F 7/11 (2006.01); G03F 7/039 (2006.01); G03F 7/004 (2006.01); G03F 7/32 (2006.01); G03F 7/038 (2006.01); G03F 7/38 (2006.01); C08F 220/18 (2006.01); C08F 220/28 (2006.01); G03F 7/09 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/40 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C08F 220/18 (2013.01); C08F 220/28 (2013.01); G03F 7/0045 (2013.01); G03F 7/0046 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/0397 (2013.01); G03F 7/091 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/2041 (2013.01); G03F 7/325 (2013.01); G03F 7/327 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); H01L 21/0274 (2013.01); H01L 21/0276 (2013.01); C08F 2220/283 (2013.01);
Abstract

The present invention has an object to provide a pattern forming method capable of providing good DOF and EL, a resist pattern formed by the pattern forming method, and a method for manufacturing an electronic device, including the pattern forming method. The pattern forming method of the present invention includes a step a of coating an active-light-sensitive or radiation-sensitive resin composition onto a substrate to form a resist film, a step b of coating a composition for forming an upper layer film onto the resist film to form an upper layer film on the resist film, a step c of exposing the resist film having the upper layer film formed thereon, and a step d of developing the exposed resist film using a developer to form a pattern, in which the active-light-sensitive or radiation-sensitive resin composition contains a hydrophobic resin.

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