The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Sep. 29, 2017
Intel Corporation, Santa Clara, CA (US);
Todd Albertson, Warren, OR (US);
Jin Yang, Hillsboro, OR (US);
Donald E. Edenfeld, Beaverton, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments may include systems and methods for manufacturing a probe for wafer sorting or die testing. A probe for wafer sorting or die testing may include a probe body and a probe tip. The probe body may include a probe core and a probe plating layer around the probe core. The probe core may include a first material, and the probe plating layer may include a second material. The probe tip may be next to the probe core of the probe body and may include the first material. In addition, the probe tip may have an end surface that is smaller than a surface of the probe core, and larger than a single point. A probe-manufacturing device may include a forging unit, a clipping unit, and an actuation mechanism to control the forging unit and the clipping unit. Other embodiments may be described and/or claimed.