The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Jul. 09, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Young-Hoo Kim, Yongin-si, KR;
Il-Sang Lee, Hwaseong-si, KR;
Yong-sun Ko, Suwon-si, KR;
Chang-Gil Ryu, Yongin-si, KR;
Kun-Tack Lee, Suwon-si, KR;
Hyo-San Lee, Hwaseong-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B23K 26/146 (2014.01); B08B 7/00 (2006.01); B08B 3/10 (2006.01); C11D 11/00 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
B23K 26/146 (2015.10); B08B 3/10 (2013.01); B08B 7/0071 (2013.01); C11D 11/0047 (2013.01); H01L 21/6708 (2013.01); H01L 21/67028 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/67248 (2013.01); H01L 21/67253 (2013.01); H01L 21/68785 (2013.01); H01L 21/68792 (2013.01);
Abstract
A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.