The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Nov. 15, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Theron L. Lewis, Rochester, MN (US);

Timothy P. Younger, Rochester, MN (US);

David J. Braun, St. Charles, MN (US);

James D. Bielick, Pine Island, MN (US);

Jennifer Bennett, Rochester, MN (US);

Stephen M. Hugo, Stewartville, MN (US);

John R. Dangler, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0081 (2013.01); H05K 1/0201 (2013.01); H05K 1/0215 (2013.01); H05K 2201/0308 (2013.01); H05K 2201/066 (2013.01);
Abstract

An apparatus for grounding a heat sink utilizing shape-memory alloy includes a printed circuit board, a logic chip, a heat sink, and a first grounding member, wherein the first grounding member is a shape-memory alloy. The apparatus further includes the logic chip electrically coupled to the printed circuit board and the heat sink disposed on a top surface of the logic chip. The apparatus further includes a first end of the first grounding member electrically coupled to the heat sink, wherein a second end of the grounding first member is disposed on a first ground land of the printed circuit board.


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