The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Nov. 09, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Christopher Boguslaw Kocon, Mountain Top, PA (US);

Simon John Molloy, Allentown, PA (US);

John Manning Savidge Neilson, Norristown, PA (US);

Hideaki Kawahara, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 29/78 (2006.01); H01L 29/08 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 21/763 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/404 (2013.01); H01L 21/763 (2013.01); H01L 29/0696 (2013.01); H01L 29/086 (2013.01); H01L 29/0865 (2013.01); H01L 29/0878 (2013.01); H01L 29/0882 (2013.01); H01L 29/1095 (2013.01); H01L 29/407 (2013.01); H01L 29/41741 (2013.01); H01L 29/41766 (2013.01); H01L 29/66348 (2013.01); H01L 29/66666 (2013.01); H01L 29/66712 (2013.01); H01L 29/66727 (2013.01); H01L 29/7802 (2013.01); H01L 29/7803 (2013.01); H01L 29/783 (2013.01); H01L 29/7811 (2013.01); H01L 29/7827 (2013.01); H01L 29/7832 (2013.01);
Abstract

A vertical, high-voltage MOS transistor, which has a source region, a body contact region, and a number of trenches structures with field plates, and a method of forming the MOS transistor increase the on-state resistance of the MOS transistor by reducing the trench pitch. Trench pitch can be reduced with metal contacts that simultaneously touch the source regions, the body contact regions, and the field plates. Trench pitch can also be reduced with a gate that increases the size of the LDD region.


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