The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Dec. 11, 2017
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Hong Chen, San Ramon, CA (US);

Michael Cook, Workingham, GB;

Pavan Kumar, San Jose, CA (US);

Kenong Wu, Davis, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06T 7/73 (2017.01); G06K 9/62 (2006.01); G06T 7/33 (2017.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G06K 9/6203 (2013.01); G06T 7/33 (2017.01); G06T 7/74 (2017.01); G06T 2207/30148 (2013.01);
Abstract

A method may include, but is not limited to, receiving a plurality of reference images of a wafer. The method may include, but is not limited to, receiving the plurality of test images of the wafer. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a coarse alignment process. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a fine alignment process after alignment via the coarse alignment process. The fine alignment process may include measuring individual offsets and correcting individual offset data between at least one of the plurality of reference images and the plurality of test images.


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