The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Jun. 12, 2017
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yi-Lin Chuang, Taipei, TW;

Ching-Fang Chen, Taichung, TW;

Jia-Jye Shen, Jhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); G06F 17/5072 (2013.01); G06F 17/5077 (2013.01); G06F 17/5081 (2013.01); G06F 2217/84 (2013.01); H01L 23/5286 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A computer implemented layout method for an integrated circuit (IC) structure and IC structure are provided. Such a method includes: placing a power supply rail pattern in a first device layer of the IC; bundling, for purposes of placement, a voltage level shifter and one or more inter-layer vias together as an integral unit; and placing the integral unit in the first device layer of the IC design such that one or more metal line patterns in the voltage level shifter are located parallel to albeit without overlapping the power supply rail pattern. The placing the integral unit forms a direct electrical connection channel between the voltage level shifter and a metal pattern in a second device layer of the IC design. At least one of the placing operations is performed using a layout generating machine.


Find Patent Forward Citations

Chuang, Yi-Lin. (2020). Method for layout design and structure with inter-layer vias (U.S. Patent No. 10566278). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10566278

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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