The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Jan. 19, 2018
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Zhaoyin D. Wu, San Jose, CA (US);

Parag Upadhyaya, Los Gatos, CA (US);

Kun-Yung Chang, Los Altos Hills, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/02 (2006.01); H01L 21/76 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01); H01L 21/84 (2006.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0288 (2013.01); H01L 21/7602 (2013.01); H01L 21/76297 (2013.01); H01L 21/76895 (2013.01); H01L 21/84 (2013.01); H01L 23/5226 (2013.01); H01L 23/645 (2013.01);
Abstract

Examples herein describe techniques for isolating portions of an IC that include sensitive components (e.g., inductors or capacitors) from return current in a grounding plane. An output current generated by a transmitter or driver in an IC can generate a magnetic field which induces return current in the grounding plane. If the return current is proximate the sensitive components, the return current can inject noise which can negatively impact other components in the IC. To isolate the sensitive components from the return current, embodiments herein include forming slots through the grounding structure which includes the grounding plane on one or more sides of the sensitive components.


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